At CES 2025, AMD introduced the Ryzen 9 9955HX3D, a high-performance notebook processor from the Ryzen 9000X3D Mobile lineup. However, a recent leak from Asus China suggests that AMD is also working on another powerful chip—the Ryzen AI Max 300 (codenamed Halo Strix), which features 3D V-Cache technology.
The leaked die design reveals the presence of TSV (Through-Silicon Vias), a crucial element that enables stacked cache (3D V-Cache) between Zen 5 cores. Another notable change in this SKU (stock-keeping unit) is the chiplet interconnect system, which is more compact than the one used in desktop Ryzen 9000 processors.
Thanks to this new design, the interconnect system takes up 42.3% less space, reducing the need for certain components like chiplets. This optimization reduces communication latency between different dies and significantly improves the chip’s overall efficiency.
Promising, Strix Halo arrives soon.
The first Ryzen AI Max 300 reviews were conducted using an Asus ROG Flow Z13, featuring the AI Max+ 395 Ryzen—a high-end mobile CPU with 8 Zen 5 cores, 16 threads, and an integrated Radeon 8060S GPU.
Performance-wise, this processor is on par with the Ryzen 9 7945HX3D, the top-tier model of its generation, and features 3D V-Cache technology. Even more impressive, its integrated GPU (iGPU) delivers performance close to a GeForce RTX 4070 for notebooks. With these specs, this mobile APU is already shaping up to be one of the fastest in its category.
