Qualcomm is gearing up to majorly impact the PC and premium laptop processor market with its upcoming ORYON V3 chip. According to leaked database records, this new processor—internally identified as SC8480XP—will feature 18 cores, a significant jump from the 12 cores found in its predecessors.
Performance is further enhanced by the integration of up to 48GB of DDR5 RAM from SK Hynix alongside a 1TB NVMe SSD, marking a major technological leap in computing power and efficiency.
Qualcomm Snapdragon X2 goes for all.
Hardware experts have highlighted that the ORYON V3 chip is a high-TDP variant designed to maximize performance despite higher power consumption and more demanding thermal management. This approach signals Qualcomm’s serious push into the high-performance computing segment, where efficiency and raw power are crucial to competing with industry giants.
System-in-Package (SiP) Integration
Qualcomm’s shift towards a System-in-Package (SiP) design is one of the most intriguing aspects of the new chip. This method integrates the CPU, LPDDR5 memory, and storage chips into a single package, reducing physical space, improving internal communication between components, and enhancing overall system efficiency.
Rumors are swirling about a possible new commercial name—”Snapdragon X2 Ultra Premium”—which suggests a more aggressive marketing strategy from Qualcomm. Internal reference tests, codenamed “Project Glymur,” further indicate that the ORYON V3 may not be limited to high-performance laptops but could also mark Qualcomm’s deeper expansion into the desktop PC market.
A Game-Changer for Next-Gen PCs
Expected to be widely available next year, the Qualcomm ORYON V3 is shaping up to be a key player in the future of computing. With a powerful combination of innovation, performance, and efficiency, this chip could reshape the competitive landscape of the PC industry.
