Samsung has unveiled its latest LPDDR5X DRAM chip, notable for being the world’s thinnest. Designed for high-end smartphones, which often include a neural processing unit (NPU) for AI tasks, this chip measures just 0.65mm thick, about the thickness of a fingernail. It is produced using 12nm lithography and will be available in 12GB and 16GB capacities.
This ultra-thin design enhances heat dissipation, with Samsung claiming a 21.2% increase in thermal resistance compared to previous LPDDR5X chips. Despite its compact size, the chip features four stacked layers, each containing two LPDDR DRAM chips.
Looking ahead, Samsung plans to develop even more advanced versions with six layers (24GB) and eight layers (32GB) for future smartphones.
“We are committed to continuous innovation in close collaboration with our customers, delivering solutions that meet future needs for low-power DRAM.”YongCheol Bae, Executive Vice President of Samsung’s Memory Product Planning Team
Samsung has not yet announced which specific models will debut with the new LPDDR5X DRAM chip. However, the company has confirmed that it will start supplying the chip to smartphone manufacturers shortly.
Source: SamMobile
