The next generation of TSMC semiconductors is expected to reach hardware manufacturers soon. According to a new rumor, 2nm wafers from the Taiwanese company will start shipping on April 1st, allowing customers to begin working with the new lithography later this year.
The report from Chinese CTEE also claims that TSMC aims to produce 50,000 wafers per month by the end of 2024 to meet growing demand. Interest in 2nm technology is already surpassing the previous 3nm generation, a trend evident since late last year.
2 Nm Lithography of TSMC is already in the advanced stage
TSMC is ramping up 2nm wafer production, with two of its factories in Kaohsiung and Baoshan focusing heavily on this next-generation technology. According to unofficial reports, the company plans to hold a production expansion ceremony on May 31, followed by the opening of technology reservations on June 1 for major clients like AMD, Intel, Broadcom, and AWS.
In its latest official update on 2nm development, TSMC stated that “N2 technology is on the right track and has made significant progress.” The N2 process will introduce TSMC’s first-generation ‘nanosheet’ transistor technology, offering major performance and energy efficiency improvements. The company has confirmed that mass production is set for 2025.
With this advancement, the semiconductor industry can expect a new wave of powerful and energy-efficient processors, GPUs, and other chips, marking a significant leap forward in performance and efficiency.
